Standard Wafer Handling
-Wafer handling 6“/ 8“
-Cassettes type 13 Slot and 25 Slot 卡
-Min. Wafer thickness ~150μm
-Max. Wafer deflection ~3mm
-”6 / 8” Centering Crescent Pre-alignment
-Easy select between Wafer- and Cassette type
Enhanced Microscan Wafer Handling
-Wafer handling 6”/ 8”
-Cassette type 13Slot and 25Slot
-Min. Wafer thickness ~70μm
-Max. Wafer deflection ~7mm
-Optical Microscan Pre-alignment
-Easy select between Wafer- and Cassette type
Optional Enhanced Microscan Soft- & Hardware
-Edge Break Detection on the Pre-alignment Station
-3D Deflection Measurement (Parameter measurement)
-Ink Dot Dry Option (IDDO) 6”/ 8” |
